Innovation in Manufacturing Processes

The latest report from IoT Analytics identifying the top smart manufacturing tech vendors is a must-read, but it also highlights a massive misconception we need to clear up. Smart Manufacturing is not a product category where you pick one "winner." This isn’t a choice between Ford and Chevy; it’s a dynamic landscape. The reality on the plant floor is that manufacturers don't just pick one of these vendors. They might pick five, ten, or twenty. These technologies stack! Your PLM feeds your cloud, which connects to your automation, which relies on your network infrastructure. Here is my take on the state of the "Stack" and where the industry is actually heading: 𝟏. 𝐓𝐡𝐞 𝐏𝐨𝐰𝐞𝐫 𝐢𝐬 𝐢𝐧 𝐭𝐡𝐞 "𝐒𝐭𝐚𝐜𝐤," 𝐍𝐨𝐭 𝐭𝐡𝐞 𝐒𝐨𝐥𝐨 𝐀𝐜𝐭 The top 10 vendors now control roughly 40% of the market. But market share is a lagging indicator. The real story is that the "un-integrated" vendor is a dead man walking. The leaders of tomorrow are those focused on IT/OT convergence, building the physical and digital "nervous system" that allows these different layers to actually talk to each other. If a vendor isn't building for a multi-vendor, interoperable reality, they aren't a partner; they will end up becoming your biggest bottleneck. 𝟐. 𝐓𝐡𝐞 𝐀𝐈 𝐌𝐢𝐫𝐚𝐠𝐞: 𝐇𝐢𝐠𝐡 𝐇𝐨𝐩𝐞𝐬 𝐯𝐬. 𝐇𝐚𝐫𝐝 𝐑𝐞𝐚𝐥𝐢𝐭𝐲 The report shows that AI-related keywords in earnings calls have spiked by 50% year-over-year. We are currently at the "Peak of Inflated Expectations." Installing AI on top of fragmented data architecture is like putting a Ferrari engine in a lawnmower. The real winners are focusing on the unified data layer first. 𝟑. "𝐒𝐨𝐟𝐭𝐰𝐚𝐫𝐞-𝐃𝐞𝐟𝐢𝐧𝐞𝐝" 𝐢𝐬 𝐭𝐡𝐞 𝐍𝐞𝐰 𝐒𝐭𝐚𝐧𝐝𝐚𝐫𝐝 The top vendors are all aggressively shifting toward software-defined architectures. This signals the end of "Black Box" automation. The future belongs to the vendors who provide the infrastructure for Physical AI, where the network isn't just a pipe, but an intelligent part of the solution. Accessibility and data flow are the new ROI. 𝟒. 𝐒𝐮𝐬𝐭𝐚𝐢𝐧𝐚𝐛𝐢𝐥𝐢𝐭𝐲 𝐚𝐬 𝐚𝐧 𝐎𝐩𝐞𝐫𝐚𝐭𝐢𝐨𝐧𝐬 𝐒𝐭𝐫𝐚𝐭𝐞𝐠𝐲 Top vendors are also leaning heavily into energy management. This is finally moving from the Marketing Department to the Operations Department. Why? Because energy is a massive, addressable cost. But you can't optimize what you don't measure. Real-time monitoring at the network edge is the only way to move from "Greenwashing" to actual "Green Performance." The Bottom Line Don't look at this Top 10 list as a shopping list where you pick one logo. Look at it as a component list. Your job isn't to buy a "Smart Factory" from a single provider; your job is to be the Chief Architect who weaves these layers into a resilient, scalable, and connected ecosystem. 𝐂𝐡𝐞𝐜𝐤 𝐨𝐮𝐭 𝐭𝐡𝐞 𝐫𝐞𝐩𝐨𝐫𝐭 𝐟𝐨𝐫 𝐲𝐨𝐮𝐫𝐬𝐞𝐥𝐟: https://lnkd.in/e64TrdY9

An experimental work pattern I am seeing at a few places is removing senior engineers from IT departments to work directly with subject matter experts to build new applications. With rapid vibe-prototyping & faster building, it makes it possible to address user needs in new ways. That expands what engineers can deliver, not just in terms of speed, but of kind. Your organizational structure was built in the time of railroads (the first org chart, below, was made for the New York & Erie Railroad in 1854). It may need to change in the time of AI.

Will Doy Pack dominate the shelf? Unthinkable a few years ago, but they are revolutionizing the beauty industries due to their flexibility, durability, and shelf-friendly design. Initially used for food, they are now widely adopted by cosmetic brands. What do you need to know about them? The stand-up pouch market, valued at $22.3 billion in 2021, is projected to grow at a CAGR of 7.6%, reaching $37.1 billion by 2028. Largest markets are North America, Europe, and Asia-Pacific, with Asia-Pacific leading due to the expanding middle class in countries like China and India. >> 4 x Best design practices. << → Reduced material, use less plastic, cut waste and lower carbon emissions. → Recyclable monomaterials, single-material pouches enhance recyclability. → Refillable, reduce single-use packaging, promote reusable containers. → Lightweighting, thinner pouches decrease material use and reduce emissions. >> 3 x Concerns to be aware? << → Residue in packs can prevent recycling, educate for proper disposal. → Often considered single-use, unless designed for refilling or recycling. → Multi-layered plastics are hard to recycle, especially in areas lacking advanced systems. >> 7 x Design innovations for you to rock it! << 1. Refillable systems Innovate with refillable doy packs, allow consumers to use permanent containers, reducing rigid packaging waste. 2. Take-back programs Adopt take-back initiatives for proper recycling or refilling, support the circular economy and minimizing waste. 3. Sustainable materials Incorporate biodegradable and compostable materials like plant-based plastics and paper-based laminates into doy packs for easier environmental degradation. 4. Digital and interactive The large printable area of doy packs are perfect for QR codes, augmented reality, and RFID chips. Emerging smart packaging features include sensors to monitor freshness and exposure to heat or light. 5. Minimalistic aesthetics Emphasizing clean designs that showcase the product. Many doy packs now include transparent windows or full transparency to build trust in product quality. 6. Eco-friendly closures Innovative closure systems on doy packs are incorporating recyclable zippers or spouts. This ensures that the entire package, including resealable closures, is environmentally friendly. 7. Customizable decorations Digital printing allow for short-run, customized designs, limited-edition or personalized products. Conclusion Popular for its versatility, sustainability and convenience. Perhaps they are the packaging solution that can differentiate your brand. I leave you with my curated selection of examples; I hope they inspire your next success. Featured brands: Beauty Pie Bulk Dirt Nature Lab OUAI Toun28 Ultrella Wise #beauty #beautybusiness #flexiblepackaging #doypack #beautypackaging

This imec roadmap to 2039 (!) has become the chip industry's go-to. So what's actually on there? 🔎 Let me walk you through it! 👇 🔢 𝗧𝗵𝗲 𝗻𝗼𝗱𝗲𝘀 𝗮𝗻𝗱 𝘁𝗵𝗲𝗶𝗿 𝘆𝗲𝗮𝗿 𝗼𝗳 𝗶𝗻𝘁𝗿𝗼𝗱𝘂𝗰𝘁𝗶𝗼𝗻  Nodes set the tempo for innovation. They are generational markers for density, performance and power improvements. So as we exit the "N" nodes and enter the "angstrom era" (A14, A10, A7…), remember: 10 angstroms = 1 nanometer. Just remember that these numbers no longer relate to anything physical on the chip. The naming is more competitive signaling between leaders like TSMC, Samsung Semiconductor and Intel. But the engineering behind each step is very real. 🧱 "𝗗𝗲𝘃𝗶𝗰𝗲 𝗮𝗻𝗱 𝗺𝗮𝘁𝗲𝗿𝗶𝗮𝗹 𝗶𝗻𝗻𝗼𝘃𝗮𝘁𝗶𝗼𝗻𝘀" 𝗶𝘀 𝗮𝗯𝗼𝘂𝘁 𝘁𝗵𝗲 𝘁𝗿𝗮𝗻𝘀𝗶𝘀𝘁𝗼𝗿𝘀 New transistor architectures deliver better performance. In FinFET transistors, the gate wraps around the channel on three sides of a silicon fin. It was the workhorse from ~22nm. Right now, the first generation of Gate-All-Around (GAA) transistors is entering production. These stacks horizontal sheets with the gate wrapping the channel on all four sides for better control and less leakage. Next up: Complementary FET (CFET) transistors. Their taller design stacks a pair of transistors on top of each other to essentially create two transistors in one fin. At the tail end: '2DFET' points to the use of 2D materials with atomic-scale thickness (~0.7nm) that could work where silicon can't. Deep future stuff. 📏 "𝗖𝗼𝗻𝘁𝗶𝗻𝘂𝗲𝗱 𝗱𝗶𝗺𝗲𝗻𝘀𝗶𝗼𝗻𝗮𝗹 𝘀𝗰𝗮𝗹𝗶𝗻𝗴" 𝗶𝘀 𝗮𝗯𝗼𝘂𝘁 𝗹𝗶𝘁𝗵𝗼𝗴𝗿𝗮𝗽𝗵𝘆  Litho enables economic scaling. ASML's Extreme ultraviolet (EUV) lithography enables today's most advanced nodes and will continue to keep the pace of chip innovation. As chip designs continue to scale and become more complex to print economically, the door to the next generation of lithography opens. We're now on the cusp of the High NA EUV era. By increasing the numerical aperture from 0.33 to 0.55, these systems bring imaging resolution down to 8nm. And an even higher numerical aperture of 0.75 would give rise to "Hyper NA" EUV systems in the 2030s. ⚡ "𝗖𝗵𝗶𝗽 𝗶𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁 𝗮𝗿𝗰𝗵𝗶𝘁𝗲𝗰𝘁𝘂𝗿𝗲" 𝗶𝘀 𝗮𝗯𝗼𝘂𝘁 𝘁𝗵𝗲 𝗶𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗲𝗱 𝗰𝗶𝗿𝗰𝘂𝗶𝘁𝗿𝘆 This is about the wiring. Today, power travels from the top through many wiring layers to reach transistors, wasting space and energy. Backside Power Delivery (BSPDN) flips the script: it routes power from the bottom via through-silicon vias, freeing the frontside for denser routing and better performance. Intel, TSMC and Samsung are all adopting this in their advanced nodes. But the complexity demands collaboration across deposition, etch, CMP, bonding and wafer thinning. 💡 In the end, a roadmap like this shows that everything has to work together. No single breakthrough carries that pace of innovation. That's what makes this industry incredibly competitive and collaborative at the same time! ❤️

Transformation thrives when people are empowered to make the most of technology. 🚀 My recent visit to the Bosch production facility for automotive and eBike drives in Miskolc, Hungary, showcased this perfectly. I was deeply impressed to see firsthand how their progress in digitalization and the implementation of the Bosch Manufacturing and Logistics Platform (BMLP) is reshaping their manufacturing operations. BMLP is a globally standardized, open IT platform that connects all stages of production and logistics. During an insightful plant tour, I observed a successful example of how the platform leads to significant improvements in efficiency, quality, and data transparency across the plant. What stood out most was seeing the passionate and enthusiastic team at Miskolc leverage this technology in action and achieving great results towards operational excellence. Here are three key areas where BMLP is contributing to the plant’s digital transformation success, powered by our NEXEED IAS: 1️⃣ Enhanced Efficiency & Reduced Downtime: The module Shopfloor Management enables a closed PDCA cycle in production by consequent integration of all relevant information in one system. This leads to quick reaction in case of deviations to minimize downtimes and safeguard the daily performance targets.   2️⃣ Improved Product Quality: Continuous monitoring throughout production stages helps the team identify issues early, ensuring top-tier quality while driving process improvements.   3️⃣ Change Management: Change management plays a crucial role in digital transformation within a plant. As seen in Miskolc, effectively managing change ensures that the workforce is engaged, and equipped to embrace new technologies, driving sustainable success. In Miskolc we have seen solutions using gamification that help to involve all associates, making the transition both engaging and effective.   I was also excited to see AI in action with a live demo of 8D Analysis using GenAI, cutting failure analysis time by half. By automating the root cause analysis process, engineers are now spending less time on administrative tasks and more on proactive problem-solving – a great example of how technology empowers people. Beyond the production lines, the most rewarding part of the visit was engaging with the team. Their passion for digitalization, commitment to upskilling, and their drive for innovation truly brought home the message: technology is only as strong as the people behind it. A special thank you to the entire Miskolc team for the inspiring discussions and warm welcome – along with Volker Schilling, Klaus Maeder, Joerg Klingler, Volker Schiek, Norbert Jung, Stephan Brand, Aemen Bouafif, and everyone who joined us on this great trip. I’m excited to see what’s next on this incredible digitalization journey!

Everyone is focused on AI chips. But power might be the real bottleneck. Intel just made a move that didn’t get enough attention. They introduced the world’s thinnest GaN chiplet. Only 19μm thick about 1/5 of a human hair. That’s impressive. But not the most important part. For the first time, they combined GaN power devices with silicon logic on the same chiplet. Built on a 300mm wafer. Here’s why that matters: • 19μm thickness → smaller, denser systems • 300GHz RF cutoff → ready for high-frequency use • 78V capability → real power applications But the real shift is architectural. Power and compute are no longer separate. They’re being merged into one system. That means: Less energy loss Less complexity Faster performance And there’s a bigger angle here. GaN is critical for telecom, EVs, defense. Now it works with existing fab infrastructure. That lowers cost. And speeds up adoption. If this scales, the conversation changes. It’s not just about faster chips anymore. It’s about how efficiently you can power them. Are we overlooking power semiconductors in the AI race? #Semiconductor #SupplyChain #Geopolitics #ChipDesign #ManufacturingTech #GaN #PowerElectronics #AIInfrastructure #AdvancedPackaging

🔌 **Industrial Communication Protocols – The Backbone of Modern Automation** In today’s fast-evolving industrial landscape, seamless communication between devices is critical for efficiency, reliability, and scalability. From shop floor sensors to cloud-based analytics, the right communication protocol makes all the difference. Here’s a quick overview every automation engineer should know: ⚙️ **Ethernet-Based Protocols** • PROFINET – High-speed, real-time industrial Ethernet • EtherNet/IP – Scalable and widely used in Rockwell ecosystems • OPC UA – Secure, platform-independent communication for Industry 4.0 🔄 **Fieldbus Protocols** • PROFIBUS – Proven, reliable for legacy and process systems • Modbus (RTU/TCP) – Simple, open, and widely supported ⚡ **High-Performance & Motion Control** • EtherCAT – Ultra-fast, low latency for motion control • CC-Link IE – Gigabit performance for Mitsubishi environments • Sercos III – Deterministic communication for CNC & drives 🔗 **Device-Level Communication** • IO-Link – Smart sensor/actuator integration • AS-i – Cost-effective wiring for discrete I/O 🏭 **Process & Building Automation** • HART – Hybrid analog + digital communication • BACnet – Standard for HVAC & smart buildings ☁️ **IIoT & Cloud Connectivity** • MQTT – Lightweight publish/subscribe protocol for cloud integration 💡 **Key Takeaway:** A strong automation system often combines Ethernet-based networks, fieldbus systems, and smart sensor communication to achieve optimal performance and flexibility. 📢 Which protocol do you use most in your projects? Share your experience below! #IndustrialAutomation #Industry40 #PLC #SCADA #IIoT #AutomationEngineering #SmartFactory #DigitalTransformation

What most people don’t know about Philips — and why Europe should not give up on innovation When people talk about global tech champions, Europe is often framed as “lagging behind.” But look more closely at Philips. Few realize that some of the most influential companies shaping today’s technology landscape emerged from the Philips ecosystem: • TSMC – founded in 1987 as a joint venture between Taiwan’s local government and private investors, with Philips as the main corporate shareholder and technology partner, whose process know-how and patents helped it get started as the world’s first pure-play foundry. • ASML – today the world leader in photolithography equipment, created in 1984 as ASM Lithography, a joint venture between Philips and ASM International to commercialize lithography technology developed in Philips’ research labs. • NXP Semiconductors – carved out of Philips’ semiconductor division in 2006, and now a global leader in automotive, secure connectivity, and industrial chips. These companies now far exceed the original parent in strategic impact on the global digital economy. This is not a story of decline. It is a story of ecosystem seeding. Another under-appreciated dimension: For decades, Philips has been a bridge builder in global innovation — deeply connected to the US technology frontier while transferring manufacturing and process capabilities into Asia, including China. Long before “decoupling” became a headline, Philips helped shape the global value chains that still underpin the semiconductor industry today. That ability to connect ecosystems across geographies is more important than ever. Three lessons I take from this: 1. Great companies can be great ancestors. Impact is not only what you keep, but what you enable. 2. Ecosystems outperform organizations. Long-term value comes from networks, not silos. 3. Europe’s strength is deep tech + global integration. If we connect it better, it can still win. Bottom line: Let’s stop writing Europe off. And start strengthening the ecosystems that turn industrial depth into global leadership — and keep Europe a bridge, not an island, in a fragmenting world. What other European “hidden ancestors” of today’s champions should we be paying attention to?

Manufacturing front or rear bumpers through powered by plastic injection molding‼️ Key engineering challenges: ➡️ Large part size – requires high-tonnage machines and precise mold alignment ➡️ Material selection – balancing impact resistance, weight reduction, and cost (PP, TPO, blends) ➡️ Flow & warpage control – ensuring uniform filling, minimizing sink marks and deformation ➡️ Surface quality – meeting Class-A aesthetic requirements while maintaining structural integrity ➡️ Cycle time optimization – achieving high-volume production without compromising quality Success lies in the integration of CAE simulations, smart gate design, effective cooling channels, and close collaboration between design, tooling, and manufacturing teams. By Stefano Meli #automation Eduardo BANZATO Peter Wirth

Germany has just unveiled one of the most transformative industrial projects in modern history — a steel plant that replaces coal entirely with green hydrogen. Built by Salzgitter AG, this facility eliminates the CO₂-heavy blast furnace process and uses hydrogen-powered direct reduction instead, cutting emissions by more than 95%. For an industry responsible for nearly 8% of global carbon pollution, this marks a massive breakthrough that proves heavy manufacturing can be clean, efficient, and future-ready. What makes this project even more significant is its scalability. If adopted globally, hydrogen-based steelmaking could dramatically lower worldwide emissions, reshape supply chains, and set a new standard for climate-friendly industry. Germany’s success sends a clear message: sustainable steel production is no longer theoretical — it’s here, operating, and ready to inspire the next wave of green industrial revolution. #GreenEnergy #HydrogenRevolution #CleanIndustry #GermanyInnovation #SustainableFuture